If you've got an electronic failure analysis question or problem or just want to bounce an idea off your F/A colleagues - this is the place to make the right connections. It's a great way to network and exchange ideas with others in the field of electronic failure analysis, and its only available to members of EDFAS.
All members of EDFAS are included in this email discussion forum automatically if you provided us with your email address.* It's a great way to network and exchange ideas with others in the field of electronic failure analysis.
Hi - anybody got a good etch for Silicon MONoxide (SiO) which has good selectivity to both Silicon (Si) and Silicon DIoxide (SiO2)?
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An old entry from our etch listings shows a 1.0:6.67 ratio of 49%HF:40%NH4F as an etch for SiO. However the entry says nothing about selectivity. Been a long time since I ever actually used the etch and don't remember whether it is any good any that regard.
Appreciate if anybody could give information on rebonding of wire bonded dice so that they can be analyzed using backside analysis tools.
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To: EDFAS Bulletin Board
Subject: Rebonding for backside analysis work
Typical wire bonded packages lose electrical integrity when one attempts to expose the backside silicon for thinning down or trench milling. So these dice may have to be rebonded at the begining of the analysis in a different package. Are there any vendors who do this regularly? Are there any best practices that users can share?
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I don't have an answer to your question, as such, but I do have an alternative method for you to use when doing the initial backside thinning. We produce a Backside Emission Analysis Preparation System (BEAPS) which is designed to polish the backside without destroying the electrical integrity. If you have an interest in more information I would be pleased to send you a data sheet and technical papers in PDF format.
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