ISTFA 2008 Heads to Portland
November 2-6, 2008
Oregon Convention Center
Portland, Oregon, USA

Topics Include:

• Advanced Techniques
• Circuit Edit for FA, FI and Debug
• Die Level Fault Isolation
• Failure Analysis Process
• MEMS
• Metrology and Materials Analysis
• Nanotechnology Analysis
• Optical Techniques
• Optoelectronic Devices
• Package Level Analysis
• Sample Preparation
• SPM Techniques
• System Level Analysis
• Test
• Yield Enhancement

View event details.

European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF)
Organized by NXP, MESA+ Institute for Nanotechnology and IMEC
Co-sponsored by IEEE Electron Devices Society and IEEE Reliability Society
September 29 - October 2, 2008
Maastricht, The Netherlands
http://esref2008.ewi.utwente.nl/

International Test Conference (ITC)
Sponsored by IEEE Computer Society
October 28-30, 2008
Santa Clara, CA
http://www.itctestweek.org/

2008

TSS Aerospace Coatings Symposium
October 15-16, 2008
Hartford, Connecticut

Cleaning Requirements for Heat Treatment-
Developments and Applications
October 29-30, 2008
Worcester, Massachusetts

34th International Symposium for Testing & Failure Analysis (ISTFA)
November 2-6, 2008
Portland, Oregon

Symposium on Improving Reliability and Consistency in Thermal Spray
December 2-3, 2008
Montreal, Quebec

2009

4th International Brazing and Soldering Conference and Exhibition (IBSC)
April 26-29, 2009
Orlando, Florida

International Thermal Spray Conference & Exposition
May 7-9, 2009
Las Vegas, Nevada

Heat Treating Society Conference & Exposition
September 14-17, 2009
Indianapolis, Indiana