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The journal for solving day-to-day engineering challenges— especially those involving components for larger systems
Published by Springer

JMEP is available online via SpringerLink.

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Description

  • Covers all aspects of materials selection, design, processing, characterization and evaluation, including:
  • How to improve materials properties through processes and process control of casting, forming, heat treating, surface modification and coating, and fabrication
  • Testing and characterization (including mechanical and physical tests, NDE, metallography, failure analysis, corrosion resistance, chemical analysis, surface characterization, and microanalysis of surfaces, features and fractures)
  • Industrial performance measurement
  • Presents a clear understanding of relationships between materials selection, processing, applications and performance

Want to get a sneak preview of the journal first? Take a look at a recent issue free online. (The green box preceding the issue number indicates that access to that issue is available.)

"A unique international journal that combines research articles with introductions to new products and technology. You can always find valuable information in every issue."


—Dr. Shuo Yang
Noise and Vibration Engineering Division
Rousch Industries

Editors:
Jeffrey A. Hawk, Editor
Rajiv Asthana, Associate Editor
Narendra Dahotre, Associate Editor

Editorial Committee:

  • David E. Alman, Chair, National Energy Technology Laboratory
  • Sai V. Raj, Vice Chair , NASA Glenn Research Center
  • Hua-Tay Lin, Secretary, Oak Ridge National Laboratory
  • Mark F. Smith, Board Liason, Sandia National Laboratories
  • Mrityunjay Singh, Past Chair, NASA Glenn Research Center
  • Rajiv Asthana, University Wisconsin-Stout
  • Srinivasa Rao Boddapati, Kennametal
  • Eldon D. Case, Michigan State University
  • Omar S. Essaid, Loyola Marymount University
  • Jeffrey A. Hawk, GE Energy
  • Scott Henry, ASM International
  • J. Ernesto Indacochea, University of Illinois at Chicago
  • Subhadarshi Nayak, Intel Corporation
  • Daniel G. Sanders, The Boeing Company
  • Ronald W. Smith, Materials Resources International
  • Kumar Sridharan, University of Wisconsin
  • Michael E. Stevenson, Metals and Materials Engineers
  • C. Suryanarayana, University of Central Florida
  • John M. Tartaglia, Stork Climax Research Services
  • Naveen Thuramalla, Transonic Systems Inc.